![]() ![]() The transverse (axial) resolutions are 4.78 mu m (6.2 mu m), 5.77 mu m (6.2 mu m), and 7.45 mu m (5.6 Am) for wavelengths of 561, 662, and 781 nm, respectively. Reflectance and fluorescence images with 650 mu m x 800 mu m field of view are demonstrated at 15 frames/s. The device has resonance frequencies of similar to 2.48 kHz and similar to 348 z for the inner and outer axis torsional modes, respectively. ![]() The scanner has electrostatic optical deflection angles of 2 degrees for the single-sided inner axis at 75 V and +/- 3 degrees for the outer axis at 120 V. The devices are large-scale batch fabricated using a double layer silicon-on-insulator (SOI) process and predice postreleasing of dies. The MEMS scanner has an inner gimbal design with torsional flexures separated more » from the reflectors to reduce light loss and oxide-free outer axis torsional flexures by utilizing poly vial for electrical access to the inner gimbal electrodes. Dual-axis confocal microscopy achieves comparable transverse and depth resolution to high numerical aperture (NA) single-axis confocal microscopy but achieves longer working distance by utilizing low-NA optics. The MEMS scanner and fabrication process has been designed to improve performance for the dual-axis confocal microscopy architecture. This paper is an expansion of work originally reported in the Proceedings of IEEE International Conference on Optical MEMS and Nanophotonics 2012. We describe a 2-D microelectromechanical systems (MEMS) scanner for a handheld multispectral confocal microscope for early detection and diagnosis of cervical cancer. They report progress on a MEMS-based laser scanner using these concepts. The MEMS components do not require the development of transparent optics and can be completely compatible with the current 5-level polysilicon process. Micro-optics can be fabricated into the substrate to reflect and refocus the light so that it can propagate from one device to another and them be directed out of the substrate into free space. The components can be surface-mounted by flip-chip bonding to the substrate. The authors explored using folded optical paths in a transparent substrate to provide the interconnection route between the components of the system. ![]() Another major difficulty with direct integration is providing the optical path for the MEMS components to interact with the light. These processes were used to demonstrate two integration examples, a MEMS discriminator driven by laser illuminated photovoltaic cells and a MEMS shutter or chopper. Significant progress was made in developing processing capabilities for adding optical function to MEMS components, such as metal mirror coatings and more » through-vias in the substrate. This project emphasized a hybrid approach to integrating optoelectronics and MEMS. The two technologies use dissimilar materials with significant compatibility problems for a common process line. ![]() Some examples of possible applications are laser beam scanning, switching and routing and active focusing, spectral filtering or shattering of optical sources. This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to investigate combining microelectromechanical systems (MEMS) with optoelectronic components as a means of realizing compact optomechanical subsystems. Interferometric measurements show that the residual stress in the 500 with a spot size of 0.5 mm. The silicon MEMS scanner consists of an actuator that continuously scans the position of a large polysilicon gold-coated shuttle containing a third DOE. Two Diffractive Optical Elements (DOEs) are etched into the fused silica substrate to focus the VCSEL beam and increase the scan range. The MEMS scanner and VCSEL are mounted onto a fused silica substrate which serves as an optical interconnect between the devices. This system integrates a silicon MEMS laser scanner, a Vertical Cavity Surface Emitting Laser (VCSEL) and passive optical components. In this work the design and initial fabrication results are reported for the components of a compact optical-MEMS laser scanning system. ![]()
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